Method of manufacturing an electronic component

ABSTRACT

An electronic component comprises an inductive element which includes a pair of zigzag parts, a pair of first terminals connected to one side of the zigzag parts, a connection part connected to the other side of the zigzag parts, an electrode disposed in the middle of the connection part, a second terminal provided on the extensional position of the electrode, and an exterior mold having a gap in the middle in order to expose the fronts of electrode and second terminal.

This application is a division of application Ser. No. 08/135,291, filedOct. 12, 1993, now U.S. Pat. No. 5,446,428.

FIELD OF THE INVENTION

The present invention relates to an electronic component such asinductive component and LC filter used in various electronic appliancesand a method of manufacturing such an electronic component.

BACKGROUND OF THE INVENTION

Prior art inductive elements are shown in FIG. 24 (a) to FIG. 24 (c).

In the drawings, a plate material such as iron alloy was blanked to forma zigzag part 1 in the middle, and straight terminal parts 2 wereprovided at both ends of the zigzag part 1.

Prior LC filters are shown in FIG. 25 (a) to FIG. 25 (d).

In FIG. 25 (a), a U-shaped lead wire 4 was inserted into a pair oftubular sintered ferrite cores 3, and a capacitive element 5 with a leadwas connected to the middle of the lead wire 4. In FIG. 25 (b), using aformed bobbin 8 having brims 6, 7 at both ends and in the middle, leadsfor external connection 9 were inserted into the brims 6 at both ends ofthe formed bobbin 8, a capacitive element 11 with leads was insertedinto a indented part 10 of the middle brim 7, windings 12 were woundbetween the brims 6 and 7 of the formed bobbin 8, outgoing wires of thewindings 12 were wound around the leads for external connections 9 andthe lead of the capacitive element 11 was connected by soldering to thewindings 12.

The prior art LC filter shown in FIG. 25 (c) includes a pair of drumcores 14 having a coil 13, and a capacitive element 15 having a pair ofaxial leads. An axial lead is connected to the coil.

In FIG. 25 (d), after forming four penetration holes 16 in a U-shapedferrite core 17, lead wires were inserted into the penetration holes 16,and the penetration holes 16 were interconnected with conductors 18 toform an inductive element, while a capacitive element 19 was disposed ina indented part of the U-shaped ferrite core 17 to connect with theconductors 18 thereby forming an LC filter. The prior LC filters weregenerally molded with resinor or encased with resin box.

The prior inductive components, LC filters and other electroniccomponents were manufactured as shown in FIG. 26 (a) to FIG. 26 (d).

In accordance with the drawings, an electric conductive hoop 21 wasblanked in an electronic component element 20 to form a terminal plate22, which was bent, connected and set in molding dice 23. Resin was thenpoured into the molding dies 23 so as to be formed into the state asshown in FIG. 26 (b). The electric conductive hoop 21 and terminal plate22 were next cut off and separated to manufacture an intermediate partas shown in FIG. 26 (c). The terminal plate 22 was then bent along theflank of an exterior mold 24, thereby fabricating an electroniccomponent for surface mounting as shown in FIG. 25 (d). That is, theelectronic component manufactured by this method possessed a pair ofterminals 22 having bottom terminals 22a and side terminals 22b on theflanks of the exterior mold 24. When forming the exterior mold, theresin deposited on the surface of the bottom terminal 22a and burrs wereformed. As a result serious interference with soldering occurred whenmounting on the surface of the electric circuit. Thus a deburringprocess was needed. As a result, the productivity was low. In addition,the terminal plate 22 was first separated from the electric conductivehoop 21 and then bent along the side surface from the corner of theexterior mold 24.

In this case, the bent part was not square due to spring-back of theterminal plate 22. Furthermore, either the side terminal 22b was clearedfrom the flank of the exterior mold 24 or the bottom terminal 22a waslifted from the bottom of the external mold 24. Therefore, surfacemounting quality was impaired, and the soldering performance with regardto mounting was poor.

Accordingly, as shown in FIG. 27, it was proposed to compose moldingdies 25 to as to draw out the terminal plate 22 vertically from thebottom of the exterior mold 24. However, this method requires highprecision processing of the drawing part of the terminal plate 22 of themolding dice 25.

Furthermore, the terminal plate 22 of the electric conductive hoop 21 istypically preliminarily bent in square direction, and the terminal plate22 could not be bent completely at a right angle. Moreover, as shown inFIG. 28 (a) to FIG. 28 (d), the terminal plate 22 integrated with anelectric conductive hoop 21 was drawn out from the side of the exteriormold 24, the terminal plate 22 was cut off to a specified dimersion fromthe electric conductive hoop 21 as shown in FIG. 28 (b), and separated,and then this terminal plate 22 was bent squarely as shown in FIG. 28(c). The terminal plate 22 was further bent along the flank of theexterior mold 24, thereby forming the bottom terminal 22a and sideterminal 22b.

Although the inductive element shown in FIG. 24 (a) to FIG. 24 (c) iseffective as an independent inductive component when molded with resininvolving magnetic powder, two inductive components are typicallycoupled. When further combined with a capacitive element, a large sizeddevice was realized which required labor for assembly. Furthermore,productivity was low.

Nevertherless, by using a resin which includes magnetic powder, themagnetic coupling increases, the attenuation is enlarged, and an eddycurrent is generated in the capacitive element to increase the loss (tanδ), thereby increasing the trap attenuation. Furthermore, when thezigzag part 1 was molded with resin in a hollow state, the zigzag partwas deformed by the resin injection pressure which resulted in thegeneration of of layer shorts and/or the lowering or variance ofinductance. Furthermore, the stable production could not be realized.

In the LC filters shown in FIG. 25 (a) to FIG. 25 (d), labor wastypically required to insert lead into the ferrite core, and plating ofhigh reliability was typically needed. Moreover, there were many placeswhere the outgoing wire of the winding and the leads are connected, theproductivity was low, and disconnections and faulty connections werelikely to occur in the connections between the outgoing wires and leads.

In the prior method of manufacturing electronic components, theinductive element was cut off and separated from the electric conductivehoop, and bent as shown in FIG. 28 (c). However, the terminal could notbe set tightly along the flank of the exterior mold.

SUMMARY OF THE INVENTION

The present invention relates to an electronic component comprising aninductive element which includes a pair of zigzag parts, a pair of firstterminals connected to one side of the zigzag parts, a connection partconnected to the other side of the zigzag parts, an electrode disposedin the middle of the connection part, a second terminal provided on theextentional position of the electrode, and an exterior mold having a gapin the middle in order to expose the front of the electrode and thefront of the second terminal. When forming the exterior mold, since thezigzag parts, terminals, connection part and electrode are held bymolding dice, deformation of the zigzag parts is prevented. As a result,the fluctuation of characteristics of the inductive element isdecreased, and an electronic component of high quality can bemanufactured stably. In addition, since the capacitive element isincorporated within the gap of the exterior mold, the LC filter can bereduced in size. Furthermore, productivity is excellent.

In addition, by using an exterior mold made of a material includingmagnetic powder, because of the presence of the gap, the magneticcoupling is suppressed, and an inductive component which is small inattentuation is obtained. Furthermore, since the trap attenuation is notincreased by the increase of the loss (tan δ) of the capacitive elementdue to eddy current, an LC filter of extremely excellent characteristicsis obtained.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plain view of an inductive component in accordance with anexemplary embodyment of the invention.

FIG. 2 is an explanatory diagram which illustrates a method ofmanufacturing an inductive component in accordance with an exemplaryembodiment of the present invention.

FIG. 3 is a partial perspective oblique view of an LC filter inaccordance with an exemplary embodiment of the present invention.

FIG. 4 is a partial perspective oblique view of an LC filter inaccordance with a further exemplary embodiment of the present invention.

FIG. 5 is an oblique view of the LC filter shown in FIG. 4.

FIG. 6 is a front view of the LC filter shown in FIG. 4.

FIG. 7 is an attenuation characteristic diagram of a reference exampleLC filter and an LC filter in accordance with an exemplary embodiment ofthe present invention.

FIG. 8 is a sectional view of an LC filter in accordance with a thirdexemplary embodiment of the present invention.

FIG. 9 is a sectional view of an LC filter in accordance with a fourthexemplary embodiment of the present invention.

FIG. 10 is a sectional view of an LC filter in accordance with a fifthexemplary embodiment of the present invention.

FIG. 11 is a front view of an LC filter in accordance with a sixthexemplary embodiment of the present invention.

FIG. 12 is a partial perspective oblique view of an inductive componenthaving a three dimensional inductive element.

FIGS. 12(a)-(c) are partial perspective views of the inductive elementsof FIG. 12.

FIG. 13 is a top view of an exterior mold.

FIG. 14 is a front view of the exterior mold shown FIG. 13.

FIG. 15 is a side view of the exterior mold shown FIG. 14.

FIG. 16 is a front view of an exterior mold which is formed by using agate in the manufacture of an inductive component in accordance with anexemplary embodiment of the present invention.

FIG. 17 is a front view of an exterior mold formed by using a supportingelement.

FIG. 18 (a) is a front view of an LC filter for surface mounting inaccordance with an exemplary embodiment of the present invention.

FIG. 18 (b) is a side view of the LC filter shown in FIG. 18 (a).

FIG. (c) is a bottom view of the LC filter shown in FIG. 18 (a).

FIGS. 19 (a)-(d) provides oblique views of an electronic component forsurface mounting in accordance with an exemplary embodiment of thepresent invention.

FIG. 20 (a)-(d) provides oblique views of an electronic component forsurface mounting in accordance with a further exemplary embodiment ofthe present invention.

FIG. 21 is a partial perspective oblique view of an LC filter inaccordance with an exemplary embodiment of the present invention.

FIG. 22 is a partial perspective oblique view of a simple inductivecomponent in accordance with an exemplary embodiment of the presentinvention.

FIG. 23 is a partial perspective oblique view of a simple inductivecomponent in accordance with an exemplary embodiment of the presentinvention.

FIG. 24 (a) is a oblique view of an inductive element in accordance withthe prior art.

FIG. 24 (b) is an oblique view of a further inductive element inaccordance with the prior art.

FIG. 24 (c) is an oblique view of a third inductive element inaccordance with the prior art.

FIG. 25 (a) is a sectional view of a further prior LC filter.

FIG. 25 (b) is a partially cut-away front view of a further prior art LCfilter.

FIG. 25 (c) is a sectional view of a third prior art LC filter.

FIG. 25 (d) is a partial perspective oblique view of a fourth prior artLC filter.

FIG. 26 (a) is a sectional view of a prior art electronic component forsurface mounting.

FIG. 26 (b) is an oblique view of the electronic component shown in FIG.26 (a).

FIG. 26 (c) is a further oblique view of the electronic component shownin FIG. 26 (a).

FIG. 26 (d) is a still further oblique view of the electronic componentshown in FIG. 26 (a).

FIG. 27 is a partial perspective oblique view of a further prior artelectronic component for surface mounting.

FIGS. 28 (a)-(d) are oblique views of a third prior art electroniccomponent for surface mounting.

DETAILED DESCRIPTION

Referring now to the drawings, several exemplary embodiments of thepresent invention are described in detail below.

Referring to FIG. 1, a first inductive component is explained.

Inductive element 28 may be manufactured by blanking an electricconductive hoop made of iron alloy, copper or copper alloy. Thisinductive element includes a pair of zigzag parts 30a, 30b, a pair offirst terminals 29a, 29b connected to one side of the zigzag parts, aconnection part 31 connected to the other side of the zigzag parts, anelectrode 32 disposed in the middle of the connection part, and a secondterminal 33 provided on the extensional position of the electrode. Anexterior mold 34 is formed by molding a resin so as to have a gap 35 inthe middle in order to expose the front of the electrode and the secondterminal.

In its manufacturing method, as shown in FIG. 2, feed holes 27 areprovided at specific intervals on one side of the electric conductivehoop 26 made of iron alloy, copper or copper alloy, and the inductiveelement 28 is continuously blanked by molding dies. Consequently, byusing molding dies, the exterior mold 34 have gap 35 to expose thefronts of the second terminal. The electrode is manufactured by moldinga resin. Finally, the electric conductive hoop 26 is cut and separatedalong line A-B. According to this manufacturing method, when forming theexterior mold, since the zigzag parts, connection part and electrode arefixed by molding dice, deformation by molding pressure is extremelydecreased, so that an inductive component of high quality can bemanufactured.

The exterior mold 34 may be made of synthetic resin. By using asynthetic resin including magnetic powder, the impedance characteristicsand noise suppressing effect of the inductive element may be enhanced.

Exemplary embodiments of the LC filter using the inductive componentshown in FIG. 1 are explained in FIG. 3 to FIG. 7.

In FIG. 3, in the gap 35 of the exterior mold 34 of the inductivecomponent shown in FIG. 1, a ceramic chip capacitor 37 of a capacitiveelement having external terminals 36 at both ends if inserted, and theexternal terminals 36 are connected to the front of electrode 32 andsecond terminal 33 by soldering or other means to form an LC filter. Thefirst terminals 29a, 29b and the second terminal 33 are drawn out fromthe exterior mold 34, and are directly inserted into a circuitsubstrate.

In the embodiments shown in FIG. 4 to FIG. 6, as in the embodiment inshown in FIG. 3, a ceramic chip capacitor 37 is incorporated into thegap 35 of the exterior mold 34, and connected to the front of electrode32 and second terminal 33 by soldering or other means. The firstterminals 29a, 29b, and the second terminal 33 drawn out to the lowerside of the exterior mold 34 are bent along the flank of the exteriormold to form an LC filter for surface mounting. An indented part 38 isprovided in the exterior mold 34, and the terminals are bent along theindented part to be disposed at the same height as the surface of theexterior mold. Thus, the LC filters shown in FIG. 4 to FIG. 6 are stablymounted for surface mounting. By using the exterior mold 34 made ofresin involving magnetic powder and since a gap 35 is formed between apair of zigzag parts 30a, 30b, the magnetic coupling is low. As as aresult, the attenuation is improved as shown in FIG. 7. That is, ascompared with embodiment C without a gap, the attenuation is smaller inembodiment D having a gap. Moreover, since the ceramic chip capacitor isincorporated by later being inserted into the gap of the exterior mod, agap is formed between the ceramic chip capacitor and the exterior mold.If a current flows in the ceramic chip capacitor, eddy current is notgenerated, and the loss (tan δ) of the ceramic chip capacitor does notincrease. Thus, the trap attenuation is not enlarged.

Exemplary embodiments of the present invention for realizingstabilization in the mounting of ceramic chip capacitor are explained.

The third exemplary embodiment of an LC filter shown in FIG. 8 includesan electrode 32 and a second terminal 33 which are exposed in the gap 35formed in the exterior mold 34, and projections 39 for positioning theexternal terminals 36 of the ceramic chip capacitor 37. Thisconfiguration results in a widening of the connection area, and anenhancement of the mounting strength of the ceramic chip capacitor tothe inductive element.

The fourth exemplary embodiment of an LC filter shown in FIG. 9comprises an electrode 32 and a second terminal which are composed of anelastic metal which are exposed in the gap 35, and a ceramic chipcapacitor 37 inserted in the gap 35. The electrode 32 and the secondterminal 33 are elastically deflected to hold the ceramic chip capacitorelastically, which is then soldered in this state.

In the fifth exemplary embodiment of an LC filter shown in FIG. 10, thedimensions of the gap 35 formed in the exterior mold 34 are smaller inthe fixing position from the insertion side of the ceramic chipcapacitor so that the ceramic chip capacitor may be inserted easily.Furthermore, when inserted up to the position of the electrode 32 andsecond terminal 33, the ceramic chip capacitor is press-fitted and heldin the gap.

In the sixth exemplary embodiment of an LC filter shown in FIG. 11, arib 40 is formed in the inner wall of the gap 35, and when press-fittingthe ceramic chip capacitor into the gap, the ceramic chip capacitor issupported by the rib 40.

In FIG. 12 to FIG. 15, moreover, the inductance is increased by a pairof three dimensional zigzag part. In this embodiment, an L-shapedhorizontal part 41 is connected to a pair of first terminals 29a, 29b,an upward part 42 is connected to this L-shaped horizontal part, anL-shaped horizontal part 43 to this upward part, a downward part 44 tothis L-shaped horizontal part, and another L-shaped horizontal part 41to this downward part. By repeating this composition, a pair of threedimensional zigzag parts 30a, 30b is formed. The other side of a pair ofzigzag parts 30a, 30b is connected to a connection part 31, anintegrated assembly of electrode part 32 and second terminal 33 isdisposed in the middle of the connection part 31, and a supporting part45 extending from a part of the zigzag parts 30a, 30b is coupled to theconnection part of the electrode 32 and second terminal 33, therebyforming an inductive element. These parts may be molded and formed inresin to compose an exterior mold 34 having a gap 35 for exposingelectrode 32, second terminal 33, and supporting part 45. The exteriormold 34 and the gap 35 are formed by holding the three dimensionalzigzag parts 30a, 30b, the electrode 32, the second terminal 33 and thesupporting part 45 by molding dice. After forming the exterior mold 34,the connection part of the electrode 32, second terminal 33 andsupporting part 45 are blanked in the gap 35, thereby forming aninductive component. Since the three dimensional zigzag parts 30a, 30bare weak in mechanical strength and are likely to be deformed whenmolding in resin, as shown in FIG. 13 to FIG. 16, the resin is injectedby using molding dice having a gate 46 at the hollow parts of the threedimensional zigzag parts 30a, 30b, so that the pressure is not directlyapplied on the three dimensional zigzag parts 30a, 30b. After molding aresin, the first terminals 29a, 29b, and the second terminal 33 areseparated from the electricconductive hoop depending on the application,and are left projected from the exterior mold 34, or may be bent alongthe flank of the exterior mold 34, thereby forming an inductivecomponent.

In the exemplary embodiment shown in FIG. 17, instead of the supportingpart 45, a supporting element 47 projecting outward is disposed in themiddle of the three dimensional zigzag parts 30a, 30b so as to besupported by dies when molding in resin.

To use an inductive component having three dimensional zigzag parts 30a,30b as an LC filter, a ceramic chip capacitor 37 is inserted into thegap 35 formed in the middle of the exterior mold 34, and connected bysoldering to the fronts of electrode 32 and second terminal 33.

FIG. 18 (a) to FIG. 18 (c) are front, side and bottom views of an LCfilter for surface mounting in an embodiment of the invention. A pair offirst terminals 29a, 29b drawn out from the bottom of an exterior mold34 are bent so as to be fitted into a dented part 38 provided in thebottom, and a pair of first terminals 29a29b are bent so as to be fittedinto a dented part 38 formed in the lower part of the flank of theexterior mold 34. Thus, the first terminals 29a, 29b and the secondterminal 33 are at the same at height as the surface the the exteriormold 34 so that the surface mounting is stable. As a result, thesoldering area is increased, and the mounting strength is improved.

Referring to FIG. 19 (a) to FIG. 19 (d), a method of manufacturing anelectronic component for surface mounting in accordance with anexemplary embodiment of the present invention is described.

FIG. 19 (a) is an oblique view after forming the exterior mold 34 havinga gap 35 by blanking an electric conductive hoop 25, and molding inresin an inductive element 28 (see FIG. 1, FIG. 2) composed of a pair offirst terminals 29a, 29b, a second terminal 33, a connection part 31,and a pair of zigzag parts 30a, 30b. At this time, the first terminals29a, 29b and the second terminal 33 drawn out from the exterior mold 34are drawn out from the joining surfaces of molding dies, and the secondterminal 33, the connection part 31, and the electrode 32 are supportedusing molding dice. Projections 48a, 48b rectangular to the drawingdirection are integrally formed in the first terminal 29a, 29b drawn outfrom the both ends of the bottom of the exterior mold 34. Next, in thestate of being coupled with the electric conductive hoop 26 as shown inFIG. 19 (b), the projections 48a, 48b of the first terminals 29a, 29bare bent squarely by using press dice or the like. In succession, asshown in FIG. 19 (c), the first terminals 29a, 29b and the secondterminal 33 are cut off and separated from the hoop 25, leaving aspecific length. At this time, the connection part of the electrode 32and second terminal 33 is cut off simultaneously to separate into theelectrode 32 and the second terminal 33. Finally, as shown in FIG. 19(d), the first terminals 29a, 29b and the second terminal 33 drawn outfrom the bottom of the exterior mold 34 are folded so as to be settled ithe dented part 38 formed at the flank of the exterior mold 34. At thistime, the projections 48a, 48b of the first terminals 29a, 29b aresettled in the dented part 38 along the flank of the exterior mold 34.Putting a ceramic chip capacitor 37 into the gap 35, the electrode 32and the second terminal 33 are soldered to make up an LC filter.

According to the manufacturing method in accordance with the exemplaryembodiment of the present invention, since the projections of theterminal are bent in the state coupled with the electric conductivehoop, it is easy to bend squarely, and the terminals can be tightlyfitted in the dented part of the flank of the exterior mold when bent.Therefore, an LC filter which is excellent in both appearance andsurface mounting performance is realized.

Another manufacturing method is explained below by reference to FIG. 20(a) to FIG. 20 (d). In this exemplary embodiment, as shown in FIG. 20(a), the first terminals 29a, 29b are drawn out from the bottom of theexterior mold 34 in the side direction, and the projections 48a, 48b areprovided in the direction parallel to the drawing direction of thesecond terminal 33. Furthermore, the projections are bent squarely asshown in FIG. 20 (b), and the first terminals 29a, 29b, and the secondterminal 33 are cut off and separated from the electric conductive hoop26, leaving a desirable length as shown in FIG. 20 (c). The firstterminals and the second terminal are then bent, and a ceramic chipcapacitor is soldered to the fronts of electrode 32 and second terminal33 in the gap 35 of the exterior mold 34, thereby forming an LC filteras shown in FIG. 20 (d).

While, a method of manufacturing an LC filter is explained in FIG. 19and FIG. 20, an inductive component may be similarly manufactured unlessa ceramic chip capacitor is incorporated in the gap 35.

In the foregoing exemplary embodiments, the inductive element 28 wasformed by blanking an electric conductive hoop, but a larger inductancemay be required depending on the application. An exemplary embodiment ofLC filter with a larger inductance is explained by reference to FIG. 21.

Using an electric conductive hoop, first terminals 29a, 29b, connectionpart 31, electrode 32, and second terminal 33 are formed by blanking,and windings 49a, 49b composed of copper wire covered with an insulatedfilm are connected between the first terminals 29a, 29b and theconnection part 31. An exterior mold 34 is formed, and a ceramic chipcapacitor 37 is incorporated in the gap 35 formed between the electrode32 and the second terminal 33. The ceramic chip capacitor 37 is solderedand connected to the fronts of electrode 32 and second terminal 33,thereby forming an LC filter with a large inductance.

Moreover, an exemplary embodiment of a simple inductive component inaccordance with the present invention is shown in FIG. 22 and FIG. 23,in which a pair of terminals 29 are provided at both ends of an electricconductive hoop, and zigzag part 30 is formed between the terminals. Oneor more outward projecting supporting elements 47 are disposed in themiddle of zigzag part 30, and the terminals 29 and the supportingelements 47 are supported and fixed by molding dies when forming theexterior mold 34 to prevent the zigzag parts 30 from deforming, so thatan inductive component with stable quality may be obtained.

Thus, according to the preset invention, when forming the exterior mold,since the terminals and the electrode are supported and fixed by moldingdies, deformation of the zigzag part is prevented, and thereforedeformation of the inductive element is smaller than that of prior art.Furthermore the fluctuation of characteristics is small, and anelectronic component of high quality may be manufactured at highproductivity. In addition, the LC filter can be reduced in size becausethe capacitive element is incorporated into the gap of the exteriormold. Excellent productivity is obtained as well.

Furthermore, using an exterior mold made of a material includingmagnetic powder and because of the presence of the gap, the magneticcoupling is suppressed, and an inductive component which is small inattenuation is obtained. In addition, the trap attenuation is notenlarged due to increase of the loss (tan δ) of the capacitive elementby eddy current. Thus, an LC component having extremely excellentcharacteristic may be obtained.

It is claimed:
 1. A method of manufacturing an electronic componentcomprising the steps of:a) blanking a metal sheet to form a continuouselectrically conductive frame, an inductive element including a pair ofzigzag parts, each having two sides, a pair of first terminals, eachconnected between one side of a respective zigzag part of the pair ofzigzag parts and said frame, a connection part connecting the othersides of each of the pair of zigzag parts, an electrode coupled to saidconnection part, and a second terminal; b) forming an external casinghaving an opening and an outer surface so that said inductive element iswithin said casing, said electrode and said second terminal protrudinginto said opening, and c) cutting and separating the pair of firstterminals from the electrically conductive frame to form said electroniccomponent.
 2. A method of manufacturing an electronic componentaccording to claim 1, further comprising bending said pair of firstterminals along the outer surface of the casing, after cutting andseparating the pair of first terminals.
 3. A method of manufacturing anelectronic component according to claim 1, further comprising the stepsof:e) positioning a capacitive element within the opening; and f)connecting said capacitive element to the second terminal and to theelectrode.
 4. A method of manufacturing an electronic componentaccording to claim 1, wherein in step a) said second terminal is coupledto said frame and in step c) said second terminal is cut and separatedfrom said frame.